UMAR MOBILES NAROWAL: Week 46 in review: Galaxy S7 rumors and next-gen chipsets

Samsung's current crown jewel – the Exynos 7420 SoC is definitely at the top of the mobile food chain and has been for a few months now, but by all accounts it is heading toward an imminent and spectacular dethroning, as the next generation of chipsets are coming and they promise to bring a huge leap forward in performance. Huawei's Kirin 950 has all the odds of being first off the starting line inside the Mate 8, but what the industry seems to be truly looking forward are Qualcomm's Snapdragon 820 and Samsung's Exynos 8890. Both got their full specs revealed last week and the latter is even official, so all we have to do now is play the waiting game and hope they appear in devices as soon as possible.

And the wait might not be that long. People are already discussing Samsung's next flagship – the Galaxy S7, which will most-likely host the debut of the Exynos 8890, but also, quite possibly, the Snapdragon 820 in an alternative model. The rumor mill is already flooding with bits about the S7 and it seems this year the Korean giant will host the unveiling even sooner than last year – on February 21. This is surely putting a lot of strain on Samsung, but the OEM also seems to be hard at work on expanding its "A"-series, with the Galaxy A9, as well as alleged new version of the A3 and A5 handsets.
Speaking of upcoming devices, the powerful Huawei P9max was spotted online, allegedly carrying a massive 6.2 inch QHD+ display and a Kirin 950 chip. We also have the next Xiaomi Mi5 flagship to look forward to and the Lenovo Vibe X3.
In other news, Blackberry is expanding its Android effort with the option to sideload its app suit, as well as talks of a new handset – the Vienna.